To improve a soldered joint between a mounting part and a board in mechanical strength and to lessen the mounting part in mounting area by a method wherein the mounting part is equipped with terminals welded to the board through the intermediary of solder, and the part of the terminal jointed to the board is made reticulate or porous.

An electrode terminal 14 which includes a jointing part 14a jointed to a printed board and is formed of rectangular metal meshes, which are of copper or brass plated for example with nickel, silver, and solder and bent into an L-shape in cross section so as to spread over the sides 2a and 2b of a surface-mounting part 11. The surface-mounting part 11 is mounted on the printed board bringing the jointing parts 14a of the electrode terminals 14 into contact with land pads provided to the printed board, and molten solder is applied to the joining part 14a or the rectangular metal meshes and solidified penetrating into the meshes of metal. Through this setup, a contact area between the jointing parts 14a of the electrode terminal 14 and solder is enlarged to enable only with the jointing parts 14a of the electrode terminals 14 located at the base of the surface-mounting part 1 to realize their soldered joints high in strength for themselves, so that land pads can be reduced in area.