To enhance soldering strength of a switch for mounting on a substrate and, at the same time, to prevent infiltration of flux into an inside of the switch.

By providing an opening 32 at a terminal 30 protruded from the side face of a housing, a soldering fillet is formed around an inside of the opening 32 as a soldering connection face of the terminal 30 is soldered on a solder-mounting face 51 of the substrate 50, so that soldering connection strength is enhanced.