Title:
TERMINUS DETECTOR IN REMOVING FILM OF SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP3180051
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To hold abrasive history of all wafers and give detection sensitivity by a method wherein a sensor for generating a signal answering a film removal process is coupled to a positive feedback amplifier having a mode selector and this positive feedback amplifier is coupled to an analyzer.
SOLUTION: A sensor 100 is coupled to a film to be grounded and generates a signal, and variations of the signal are propotional to variations of a thickness of a film when removed under the sensor. Accordingly, when a thickness of the film is decreased, a signal further varies. The signal from the sensor 100 is supplied to a positive feedback amplifier 104 by connecting means 102. The positive feedback amplifier 104 can increase a signal (frequency mode), and automatically set a gain (automatic amplitude mode), and supplies the signal to a filter 106, and removes high-dimensional higher harmonics if necessary. Next, the filtered signal is supplied to an analyzer 108, which monitors the signal and transmits data to a computer.
Inventors:
Lepin Li
Stephen G. Barbie
Arnold Harperin
Stephen G. Barbie
Arnold Harperin
Application Number:
JP5916397A
Publication Date:
June 25, 2001
Filing Date:
March 13, 1997
Export Citation:
Assignee:
International Business Machines Corporation
International Classes:
B24B37/04; B24B49/02; H01L21/304; G01B7/06; G01N27/00; G01R27/00; (IPC1-7): H01L21/304; B24B37/04
Domestic Patent References:
| JP6320416A | ||||
| JP794452A | ||||
| JP584658A | ||||
| JP8306648A | ||||
| JP8210833A | ||||
| JP740234A |
Attorney, Agent or Firm:
Jiro Yamamoto (2 outside)