Title:
TEST BOARD REMOVER
Document Type and Number:
Japanese Patent JPS5245875
Kind Code:
A
Abstract:
PURPOSE:To easily isolate an LSI by placting a test board placed thereon with the LSI on a hot plate maintained at a high temperature, and melting the solder joint between the LSI and the test board by the heat given from the hot plate.
Inventors:
NAITOU TADAO
SAIKI MASAJI
SONODA MASAO
SAIKI MASAJI
SONODA MASAO
Application Number:
JP12078075A
Publication Date:
April 11, 1977
Filing Date:
October 08, 1975
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/66; (IPC1-7): H01L21/66