PURPOSE: To make it possible to carry out a test with high preciseness without prolonging the length of a signal to an element to be measured, by forming a test head main body used in a semiconductor test apparatus into a superimposed structure to enable the use of said test head main body in a separated state when plual elements to be measured are tested.

CONSTITUTION: When a test head main body 10 is superimposed to a test head main body 1 to electrically connect the contact terminal 30 of an electronic measuring circuit (not shown by the drawing) in the test head main body 10 to a predetermined contact pin 5 through an extended contact terminal 7 and the wiring (not shown by the drawing) of a performance board 4, the measurement of an element 6 to be measured can be performed by two test head main bodies 1, 10 in a state connecting an electrode to said contact pin 5 directly or connecting terminal pin thereto through a socket (not shown by the drawing). That is, the measurement of the element 6 to be measured having plural electrodes or plural pins is enabled.