To provide a test socket for semiconductor device having excellent maintainability in which good electrical contact with a probe is ensured regardless of variation in the height of external connection terminals and a test can be carried out continuously even if solder chips of the external connection terminals are deposited through repeated use.

The test socket for semiconductor device is provided with a connection sheet 2 comprising an elastically deformable insulating member and electrodes 202 and connecting a test probe 1 electrically with external connection terminals 14a in order to ensure good electrical contact through flexibility. The connection sheet 2 is replaceable and it is replaced with a new one when the contact resistance is increased due to deposition of solder chips in order to recover the contact performance.