TESTING OF ATTACHING CONDITION OF PROTECTIVE AND ADHESIVE TAPE ON THE SURFACE OF WAFER

Title:

TESTING OF ATTACHING CONDITION OF PROTECTIVE AND ADHESIVE TAPE ON THE SURFACE OF WAFER

Document Type and Number:

Japanese Patent JPH05144911

Kind Code:

A

Abstract:

PURPOSE: To increase the inspection accuracy for the attaching condition of a protective and adhesive tape which is attached to the surface of a wafer.

CONSTITUTION: The device is provided with a heating table 7 for heating a wafer W, an equipment controlling section 14 which starts the photographing of an infrared camera 10 after the wafer W is heated for a specified period of time, and an image processing section 25 which determines an area of a part of a protective and adhesive tape which is not adhered tightly to the surface of the wafer W from a digitized infrared image and which judges the attaching condition of the tape. In this method, the attaching condition of the tape is inspected by using, a primary quantity, a quantity of infrared rays emitted from the surface of the wafer W.

Inventors:

KAWABATA KATSUYA

Application Number:

JP12474991A

Publication Date:

June 11, 1993

Filing Date:

April 25, 1991

Export Citation:

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Assignee:

NITTO DENKO CORP

International Classes:

G01R31/26; H01L21/301; H01L21/66; H01L21/78; (IPC1-7): G01R31/26; H01L21/66; H01L21/78

Attorney, Agent or Firm:

Tsutomu Sugitani

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