TETRAFLUOROETHYLENE RESIN MOLDING MATERIAL EXCELLENT IN HIGH-FREQUENCY ELECTRICAL PROPERTIES

Title:

TETRAFLUOROETHYLENE RESIN MOLDING MATERIAL EXCELLENT IN HIGH-FREQUENCY ELECTRICAL PROPERTIES

Document Type and Number:

Japanese Patent JP2001288227

Kind Code:

A

Abstract:

To provide a fluororesin molding material which is easily molded, exhibits excellent electrical properties in the microwave region, especially a low dielectric tangent, can give a molded article excellent in surface smoothness, and is useful as a material for microwave apparatuses such as satellite communication apparatuses and portable telephone base stations, e.g. as a covering material for coaxial cables.

This tetrafluoroethylene resin molding material, excellent in high-frequency electrical characteristics, gives a molded article having a specific permittivity at 12 GHz of 2.2 or lower and a dielectric tangent of 1.90 ×10-4 or lower. Preferably, a copolymer of 99.9-99.9999 mol% tetrafluoroethylene and 0.0001-0.1 mol% specific perfluoromonomer is used as the tetrafluoroethylene resin.

Inventors:

ONO SHINSEI
NANBA YOSHINORI
KASAI SHUNJI
YOSHIMOTO HIROYUKI
YANO SHINICHI
SHIMIZU TETSUO

Application Number:

JP2000236094A

Publication Date:

October 16, 2001

Filing Date:

August 03, 2000

Export Citation:

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Assignee:

DAIKIN IND LTD

International Classes:

C08J5/00; B29C47/00; C08F214/26; C08F259/08; H01B3/44; H01B11/18; (IPC1-7): C08F214/26; B29C47/00; C08F259/08; C08J5/00; H01B3/44; H01B11/18

Attorney, Agent or Firm:

Sota Asahina (1 person outside)

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