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Title:
THERMAL ANALYSIS DATA PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP3102368
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a thermal analysis data processing device which assures simple processing when a plurality of thermal analysis data measured in the temp. rising or falling process are to be divided.
SOLUTION: The thermal analysis data measured in the temp. rising or falling process is plotted with respect to the temp. axis to generate a data curve, and it is arranged so that the dividing posits a, b, c, d of each data curve and sought automatically within a program only by specifying tow arbitrary dividing ranges (i) and (ii) with respect to the temp, axis of the obtained data curve, thereby making it possible to divide the data while it is associated with the temp. axis as it is without requiring complicated works involving once plotting the data with respect to the time axis. Because the arrangement includes a function to specify the target data among divided data on a display screen, the data to be analyzed can be selected without risk of confusion even if a plurality of data are displayed in overlapping.


Inventors:
Hiromichi Nakajima
Application Number:
JP1919797A
Publication Date:
October 23, 2000
Filing Date:
January 31, 1997
Export Citation:
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Assignee:
SHIMADZU CORPORATION
International Classes:
G01N25/16; G01N25/20; (IPC1-7): G01N25/20; G01N25/16
Domestic Patent References:
JP59183354A
JP4303752A
Attorney, Agent or Firm:
Yoshiro Kurauchi