Title:
熱基材
Document Type and Number:
Japanese Patent JP2022504391
Kind Code:
A
Abstract:
熱基材は、多層膜と、多層膜の第１外層に接着された第１導電層と、多層膜の第２外層に接着された第２導電層とを含む。多層膜は、第１熱可塑性ポリイミドを含む第１外層と、ポリイミドを含むコア層と、第２熱可塑性ポリイミドを含む第２外層とを含む。多層膜は、５～１５０μｍの範囲の総厚さを有し、第１外層、コア層及び第２外層は、それぞれ、熱伝導性充填剤を含む。第１導電層及び第２導電層は、それぞれ、２５０～３０００μｍの範囲の厚さを有する。
Inventors:
Christopher Banks Bex
Rosa Irene Gonzalez
Thomas Dee Lanzer
Rajesh Turi Party
Rosa Irene Gonzalez
Thomas Dee Lanzer
Rajesh Turi Party
Application Number:
JP2021518889A
Publication Date:
January 13, 2022
Filing Date:
October 08, 2019
Export Citation:
Assignee:
DuPont Electronics Incorporated
International Classes:
H05K1/03; B32B7/027; B32B27/20; B32B27/34
Domestic Patent References:
| JP2012213900A | 2012-11-08 | |||
| JP2014001392A | 2014-01-09 |
Foreign References:
| WO2014208644A1 | 2014-12-31 | |||
| WO2017209060A1 | 2017-12-07 |
Attorney, Agent or Firm:
Patent Business Corporation Tani / Abe Patent Office
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