Title:
熱伝導性接着剤
Document Type and Number:
Japanese Patent JP5489261
Kind Code:
B2
Abstract:
Provided is an electric insulation thermal conductive adhesive having excellent adhesion to a heating member and a radiating member, and excellent thermal conductibility. The thermal conductive adhesive contains (A) 100 weight parts of polyimide polysiloxane resin which weight-average molecular weight is 5,000 to 150,000 and contains a repeat unit represented by a formula (1), in the formula (1), W represents a four-valence organic group, X represents a bivalence organic group, Y represents a bivalence polysiloxane residue represented by a formula (2), in the formula (2), R1 represents substitutional or non-substitutional monovalent hydrocarbon radical containing 1 to 8 of carbon atoms respectively, R2 represents a free radical polymerization group, a and b are integer from 1 to 20 respectively, a+b=2-21, 0.05<=m<=0.8, 0.2<=n<=0.95, m+n=1; (B) 100-10,000 weight parts of electric insulation thermal conductive filling; and (C) an organic solvent. The chemical formula (1) and the chemical formula (2) are shown in the description.
Inventors:
Yoshinori Yoneda
Michihiro Sugo
Michihiro Sugo
Application Number:
JP2009098418A
Publication Date:
May 14, 2014
Filing Date:
April 14, 2009
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09J179/08; C08G73/10; C09J11/04; C09J11/06; C09J183/10; H01L21/52
Domestic Patent References:
| JP2008308618A | ||||
| JP10245539A | ||||
| JP5117621A | ||||
| JP2003138241A | ||||
| JP2004137411A | ||||
| JP8283692A | ||||
| JP2000212518A | ||||
| JP5335354A | ||||
| JP4222889A | ||||
| JP4345682A |
Foreign References:
| WO2008026786A1 |
Attorney, Agent or Firm:
Mitsuo Matsui