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Patent Searching and Data


Title:
熱伝導率制御体、隔壁、および構造物
Document Type and Number:
Japanese Patent JP7363579
Kind Code:
B2
Abstract:
To provide a thermal conductivity control body capable of changing thermal conductivity depending on temperature, and a partition wall and a structure.SOLUTION: A thermal conductivity control body according to the present invention has a configuration in which at least two thermally conductive material plates are laminated and arranged via a separating layer, the two thermally conductive material plates are held so as to be capable of changing from a separation state to a contact state and from the contact state to the separation state, a first bimetal plate is arranged on an upper side of an uppermost part in a lamination direction of the thermally conductive material plates, and a second bimetal plate is arranged on a lower side of a lowermost part in the lamination direction of the thermally conductive material plates.SELECTED DRAWING: Figure 1

Inventors:
Hiroyuki Suzuki
Ai Okano
Application Number:
JP2020034645A
Publication Date:
October 18, 2023
Filing Date:
March 02, 2020
Export Citation:
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Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
F28F3/08; E04B1/80; E04C2/08; F28F13/00; G05D23/275
Domestic Patent References:
JP7239089A
JP2013243365A
JP2018132193A
Foreign References:
WO2018151198A1
US9025333
US5643485
Attorney, Agent or Firm:
Hiromi Fujimasu
Keiko Fukamachi
Hideo Ito
Naoki Goto
Hideyuki Tateishi