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Patent Searching and Data


Title:
THERMAL CONDUCTIVITY EVALUATION SYSTEM AND EVALUATION METHOD FOR THE SAME
Document Type and Number:
Japanese Patent JP2014235148
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an evaluation device and evaluation method usable for quantitatively evaluating thermal conductivity in a surface direction of an examination member, such as a thermal-conduction sheet.SOLUTION: A thermal conductivity evaluation device includes a heating member (A) and a heat receiving member (B) which are laminated through a heat insulating layer (C). The heating member (A) and the heat receiving member (B) have a part connectable to an examination member (D). A method evaluates thermal conductivity of the examination member (D) using the evaluation device.

Inventors:
KATO NAOKI
TANII SHOTA
SHIMOOKA SUMIO
Application Number:
JP2013118777A
Publication Date:
December 15, 2014
Filing Date:
June 05, 2013
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
G01N25/18
Domestic Patent References:
JPS54137381U1979-09-22
JP2013088258A2013-05-13
JP2012032196A2012-02-16
JP2009244084A2009-10-22
Foreign References:
CN103091354A2013-05-08
Attorney, Agent or Firm:
Michihiro Kono
Takayuki Ono