THERMAL CONDUCTIVITY INTERFACE FOR ELECTRONIC DEVICE

Japanese Patent JPH1142730

A

PROBLEM TO BE SOLVED: To provide interface, which has excellent mechanical, electrical, thermal, and chemical characteristics, and can be assembled in low pressure flow by constructing a laminated sheet having specified outer layers arranged on both sides of a specified base. SOLUTION: Thermal conductivity interface having mechanical adaptability is composed of a laminated sheet having outer layers arranged on both sides of a base, which is selected from a layer group comprising glass fiber, aluminum foil, expanded metal, polyimide, or polyester. The outer layers have construction represented by a formula (R1 is selected from a group composed of a hydrogen, hydroxyl, or methyl group, and x is an integer having 1-1,000 value), and are composed of organosiloxane having approximately 10-10,000 centipoise viscosity, and poly-dimethyl siloxane having, for example, a hydrogenated end. And they are constructed of reactive product composed of a mixture with a dihydryl aliphatic chain extender having approximately 10-10,000 centipoise viscosity. The reactive product is filled with fine particle solid of approximately 10-60% amount in volume, and the rest is the reactive product.

WO/2011/163025	ELECTRONIC DEVICE MODULE COMPRISING HETEROGENEOUS POLYOLEFIN COPOLYMER AND OPTIONALLY SILANE
JP6878771	Vacuum heat insulating material and its manufacturing method

STEVEN E BURGERSON

JP18954297A

February 16, 1999

July 15, 1997

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BERGQUIST CO THE

B32B17/10; B32B27/00; C08G77/04; C08G77/44; G06F1/20; H01L23/36; B32B7/02; (IPC1-7): B32B7/02; B32B17/10; C08G77/04; C08G77/44; G06F1/20; H01L23/36

Akira Asamura (3 outside)

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