Title:
熱伝導率測定装置及び熱伝導率測定方法
Document Type and Number:
Japanese Patent JP7106073
Kind Code:
B2
Abstract:
To provide a thermal conductivity measurement device that has a simple structure, is easily downsized, provides a simple temperature control, and has an inexpensive price, and provide a thermal conductivity measurement method.SOLUTION: A thermal conductivity measurement device includes: a cooling hot plate that can be made to adhere to surface on one direction side of a tabular test piece; a main hot plate that can be made to adhere to the center part of the surface on the other direction side on the opposite to the one direction side of the test piece; a tabular heat insulation material for forming a contact condition with the other direction side of the main hot plate; and a protection/backflow prevention hot plate in which the peripheral part on the one direction side can adhere to the peripheral part of the surface on the other direction side of the test piece, and the center part on the one direction side forms a contact condition with the surface on the other direction side of the heat insulation material. The center part on the one direction side of the protection/backflow prevention hot plate has a recess that engages with the main hot plate and heat insulation material.SELECTED DRAWING: Figure 1
Inventors:
Takahiro Tsutsumoto
Koji Hasegawa
Yuta Habara
Koji Hasegawa
Yuta Habara
Application Number:
JP2018243071A
Publication Date:
July 26, 2022
Filing Date:
December 26, 2018
Export Citation:
Assignee:
Hiroshima
International Classes:
G01N25/18
Domestic Patent References:
| JP52165680U | ||||
| JP5637034U | ||||
| JP201388258A | ||||
| JP2006153618A | ||||
| JP200740793A | ||||
| JP201568788A |
Foreign References:
| US7540656 |
Attorney, Agent or Firm:
Yoshimitsu Tamura
Takeda Furuta
Takeda Furuta