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Title:
熱伝導率測定装置及び熱伝導率測定方法
Document Type and Number:
Japanese Patent JP7282238
Kind Code:
B2
Abstract:
To provide a method and a device for measuring a thermal conductivity that can measure the temperature of a measurement target body highly accurately with a high certainty and a rapid responsivity.SOLUTION: The thermal conductivity measuring device includes: a temperature sensing unit 41 for detecting a temperature; a thin film temperature sensing element 1 for a measurement capable of measuring a temperature; and a control processing unit 5 for applying a first heat pulse of a constant power to the thin film temperature sensing element 1 for a measurement and calculating the thermal conductivity of a measurement target body in a predetermined time after the first heat pulse stops being applied, and applying a second heat pulse of a constant power with a longer time width than that of the first heat pulse to the thin film temperature sensing element 1 for a measurement and calculating the thermal conductivity of the measurement target body in a predetermined time after the second heat pulse stops being applied.SELECTED DRAWING: Figure 9

Inventors:
Shigenao Maruyama
Takahiro Okabe
Yuya Iseki
Takashi Nonaka
Takuma Furukawa
Yasushi Hosokawa
Yutaro Tabata
Naofumi Matsudate
Toshinori Nakajima
Masaya Higashi
Folding door study
Application Number:
JP2022097479A
Publication Date:
May 26, 2023
Filing Date:
June 16, 2022
Export Citation:
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Assignee:
semitec corporation
National Institute of Technology
Hirosaki University
International Classes:
G01N25/18; A61B5/00; A61B5/01; A61B10/00
Domestic Patent References:
JP2016217885A
JP2016501376A
JP2017009584A
JP2018196722A
JP2015119895A
JP2004526147A
Foreign References:
US20150339830
Attorney, Agent or Firm:
Junichi Izumi