Title:
熱伝導率測定装置及び熱伝導率測定方法
Document Type and Number:
Japanese Patent JP7282238
Kind Code:
B2
Abstract:
To provide a method and a device for measuring a thermal conductivity that can measure the temperature of a measurement target body highly accurately with a high certainty and a rapid responsivity.SOLUTION: The thermal conductivity measuring device includes: a temperature sensing unit 41 for detecting a temperature; a thin film temperature sensing element 1 for a measurement capable of measuring a temperature; and a control processing unit 5 for applying a first heat pulse of a constant power to the thin film temperature sensing element 1 for a measurement and calculating the thermal conductivity of a measurement target body in a predetermined time after the first heat pulse stops being applied, and applying a second heat pulse of a constant power with a longer time width than that of the first heat pulse to the thin film temperature sensing element 1 for a measurement and calculating the thermal conductivity of the measurement target body in a predetermined time after the second heat pulse stops being applied.SELECTED DRAWING: Figure 9
Inventors:
Shigenao Maruyama
Takahiro Okabe
Yuya Iseki
Takashi Nonaka
Takuma Furukawa
Yasushi Hosokawa
Yutaro Tabata
Naofumi Matsudate
Toshinori Nakajima
Masaya Higashi
Folding door study
Takahiro Okabe
Yuya Iseki
Takashi Nonaka
Takuma Furukawa
Yasushi Hosokawa
Yutaro Tabata
Naofumi Matsudate
Toshinori Nakajima
Masaya Higashi
Folding door study
Application Number:
JP2022097479A
Publication Date:
May 26, 2023
Filing Date:
June 16, 2022
Export Citation:
Assignee:
semitec corporation
National Institute of Technology
Hirosaki University
National Institute of Technology
Hirosaki University
International Classes:
G01N25/18; A61B5/00; A61B5/01; A61B10/00
Domestic Patent References:
JP2016217885A | ||||
JP2016501376A | ||||
JP2017009584A | ||||
JP2018196722A | ||||
JP2015119895A | ||||
JP2004526147A |
Foreign References:
US20150339830 |
Attorney, Agent or Firm:
Junichi Izumi
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