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Title:
THERMAL DEVICE
Document Type and Number:
Japanese Patent JP2013221729
Kind Code:
A
Abstract:

To provide a technology capable of providing work procedure relating to installation of a thermal device with flexibility, in the thermal device including a heat pump unit, a tank unit and a gas heat source unit.

A thermal device includes a heat pump unit 40 containing a heat pump for absorbing heat from natural environment, a tank unit 20 containing a tank for storing a heat medium heated by the heat pump, and a gas heat source unit 50 containing a gas heat source device for heating the heat medium stored in the tank by combustion heat of a gas. In the thermal device, an air removing operation for removing the air of the heat medium path between the heat pump and the tank, can be executed while the installation of the heat pump unit and the tank unit is completed, and the installation of the gas heat source unit is not completed.


Inventors:
CHIKAMAWARI SATOSHI
OGAWA HIDEAKI
HONDA ATSUSHI
TANAKA HIROKAZU
Application Number:
JP2012095723A
Publication Date:
October 28, 2013
Filing Date:
April 19, 2012
Export Citation:
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Assignee:
RINNAI KK
SHARP KK
International Classes:
F24H1/00; F24H1/18
Domestic Patent References:
JP2011220571A2011-11-04
JP2004239581A2004-08-26
JP2007285657A2007-11-01
JP2000292002A2000-10-20
JP2009097824A2009-05-07
JP2011196569A2011-10-06
Attorney, Agent or Firm:
Kaiyu International Patent Office



 
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