Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
THERMAL ELECTROMAGNETIC WAVE DETECTION ELEMENT CHIP AND THERMAL ELECTROMAGNETIC WAVE DETECTOR, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2014059249
Kind Code:
A
Abstract:

To provide a thermal electromagnetic wave detection element chip capable of preventing cracks from occurring between a main body and end portion of an arm piece even when the contour of the arm piece is reduced.

A support plate is disposed being faced to a base member being interposed by a space layer. The thermal electromagnetic wave detection element is supported on the support plate. An arm piece 29 extends from the support plate. An end portion 31 of the arm piece 29 is supported on the top surface of a support post 41. A reinforcement part 52 is formed integrally with a curved contour 53 so as to continue to a contour 51 of the end portion 31 which extends along the contour of support post 41 in plan view. A sharp V-like shape is avoided to be formed. Thus, even when the support plate is curled, generation of cracks can be prevented from being generated between the main body 29a and the end portion 31.


More Like This:
Inventors:
TSUCHIYA YASUSHI
Application Number:
JP2012205345A
Publication Date:
April 03, 2014
Filing Date:
September 19, 2012
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEIKO EPSON CORP
International Classes:
G01J1/02; B81B7/02; H01L37/02; H04N5/33; G01J5/48
Domestic Patent References:
JP2011153871A2011-08-11
JP2000356545A2000-12-26
JP2012173235A2012-09-10
JP2007171170A2007-07-05
Attorney, Agent or Firm:
Masahiko Ueyanagi
Kazuhiko Miyasaka
Kazuaki Watanabe