Title:
THERMAL ELECTROMAGNETIC WAVE DETECTOR, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2013152113
Kind Code:
A
Abstract:
To provide a thermal electromagnetic wave detector having an enhanced sensitivity.
A first substrate 15 includes an integrated circuit. A second substrate 16 is joined to the first substrate 15 at a second face which is on the rear side of a first face. The second substrate 16 is electrically connected to the integrated circuit through conductive terminals 17 and 85 arranged at the second face. The first face of the second substrate 16 is provided with one or more thermal electromagnetic wave detection element 18. The surface of the second substrate 16 is provided with conductive wiring 32a and 32b to form a current path. The thermal electromagnetic detection element 18 is inserted in the current path.
Inventors:
NODA TAKASHI
Application Number:
JP2012012213A
Publication Date:
August 08, 2013
Filing Date:
January 24, 2012
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
G01J1/02; H01L21/822; H01L27/04; G01J5/48
Domestic Patent References:
| JP2007171174A | 2007-07-05 | |||
| JP2010181405A | 2010-08-19 | |||
| JP2011179953A | 2011-09-15 | |||
| JPH0219727A | 1990-01-23 |
Foreign References:
| US20110134251A1 | 2011-06-09 | |||
| WO2007129547A1 | 2007-11-15 |
Attorney, Agent or Firm:
Inoue Ichi
Takekoshi Noboru
Yasushi Kuroda
Takekoshi Noboru
Yasushi Kuroda