Title:
熱機器
Document Type and Number:
Japanese Patent JP6811050
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a technology for improving an energy efficiency in a thermal apparatus having a heat pump heat source.SOLUTION: The thermal apparatus includes a heat pump unit having the heat pump heat source for heating a thermal medium, a tank unit having a tank for storing the thermal medium heated by the heat pump heat source, and a control device capable of communicating with an external device and acquiring an ambient temperature for one day from the external device. The control device performs a heating operation for driving the heat pump power source and making the tank to store the thermal medium heated by the heat pump heat source. The control device identifies a time point at which the ambient temperature is highest in a day, specifies a first starting time point to start the heating operation at the identified time point of the highest temperature in the day, and starts the heating operation at the first starting time point.SELECTED DRAWING: Figure 4
More Like This:
Inventors:
Hatake Seishu
Application Number:
JP2016146496A
Publication Date:
January 13, 2021
Filing Date:
July 26, 2016
Export Citation:
Assignee:
Rinnai Corporation
International Classes:
F24H4/02
Domestic Patent References:
| JP2011247513A | ||||
| JP2013224762A | ||||
| JP2011069588A |
Attorney, Agent or Firm:
Kaiyu International Patent Office