Title:
熱式流速・流量センサ
Document Type and Number:
Japanese Patent JP7365049
Kind Code:
B2
Abstract:
To provide a thermal flow velocity and flow rate sensor with which, although of a simple structure, it is possible to reduce the effect of directivity characteristic of heat generation and heat radiation by a circuit unit on the surface and reverse side of a substrate.SOLUTION: The thermal flow velocity and flow rate sensor comprises: a flow velocity detection unit 2 having a temperature measurement element for detecting the temperature of heat; an atmospheric temperature measurement unit 3 for measuring an atmospheric temperature; a circuit unit 4 for computing the flow velocity and flow rate of a fluid; and a substrate 1 on which the flow velocity detection unit 2, the atmospheric temperature measurement unit 3 and the circuit unit 4 are mounted. The substrate 1 includes a substrate main part 10 where the circuit unit 4 is mounted, a first substrate portion 11 where the flow velocity detection unit 2 is mounted, and a slender support part 13 for flow velocity detection, which integrally extends from the substrate main part 10 to the first substrate portion 11 and supports the flow velocity detection unit 2, with a plurality of open holes 5 penetrating the substrate 1 being formed in the support part 13 for flow velocity detection.SELECTED DRAWING: Figure 1
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Inventors:
Yasumasa Hayashi
Application Number:
JP2020054677A
Publication Date:
October 19, 2023
Filing Date:
March 25, 2020
Export Citation:
Assignee:
Holt Plan LLC
International Classes:
G01P5/12; G01F1/684
Domestic Patent References:
| JP2015210196A | ||||
| JP11326002A | ||||
| JP2013243293A |
Foreign References:
| CN102147421A |
Attorney, Agent or Firm:
Masaki Kobayashi
Hideki Shinohara
Hideki Shinohara