Title:
THERMAL FUSE WITH RESISTANCE
Document Type and Number:
Japanese Patent JP2009146799
Kind Code:
A
Abstract:
To provide a thermal fuse with resistance for enhancing responsiveness when breaking a circuit by melting a low melting-point alloy.
The thermal fuse with resistance includes an insulating substrate 11, a low melting-point alloy 12 installed at the nearly central part of one of face 11a of the insulating substrate 11, and two resistors 14a, 14b which are installed on the other face 11b of the insulating substrate 11 and are electrically connected to an intermediate portion 12a of the low melting-point alloy 12. The two resistors 14a, 14b are arranged in parallel and are installed at the positions which are not opposed to the low melting-point alloys 12 and which pinch the low melting-point alloys 12.
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Inventors:
SENDA KENJI
WATANABE TAKESHI
NAGAFUJI KOHEI
MATSUMURA KAZUTOSHI
TSUDA SEIJI
WATANABE TAKESHI
NAGAFUJI KOHEI
MATSUMURA KAZUTOSHI
TSUDA SEIJI
Application Number:
JP2007324346A
Publication Date:
July 02, 2009
Filing Date:
December 17, 2007
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H01H37/76
Attorney, Agent or Firm:
Fumio Iwahashi
Hiroki Naito
Daisuke Nagano
Hiroki Naito
Daisuke Nagano
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