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Patent Searching and Data


Title:
THERMAL FUSE
Document Type and Number:
Japanese Patent JP2011204516
Kind Code:
A
Abstract:

To provide a thermal fuse using a low melting point metal temperature-sensitive material not containing hazardous metal such as Pb, Cd, Hg or the like and having a long-term reliability with an operation temperature of 250°C or higher.

A fixed contact 15 and a movable contact 16 are mounted on one end of lead members 12, 13 engaged in a groove portion of an insulation supporting member 11; the fixed contact 15 is provided with a supporting part with a tip end portion extending from the one lead member 12 mold-processed and a contact part is formed on this; and the movable contact 16 is provided with a contact part on a tip end portion of an elastic member 17 caulked and fixed by a rivet 14 together with the other lead member 13. A low melting point metal temperature-sensitive material 20 of a Bi system or a Zn system having an operation temperature of 250°C or higher is housed in a circular-shaped deep groove 18 formed almost at the center of the insulation supporting member 11 in a state of a part or a whole directly contacting with the outside air.


Inventors:
YOSHIKAWA TOKIHIRO
KISHI EIGO
Application Number:
JP2010071564A
Publication Date:
October 13, 2011
Filing Date:
March 26, 2010
Export Citation:
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Assignee:
NEC SCHOTT COMPONENTS CORP
International Classes:
H01H37/76; C22C12/00; C22C18/00; C22C18/02; C22C18/04; C22C23/04; C22C30/06