Title:
THERMAL FUSE
Document Type and Number:
Japanese Patent JP3885995
Kind Code:
B
Abstract:
PROBLEM TO BE SOLVED: To provide an alloy thermal fuse which is free from lead and cadmium causing environmental problems and has excellent operation reliability at 140 to 150°C.
SOLUTION: This thermal fuse is a fusible-alloy-type thermal fuse using low-melting alloy as a thermosensor, and the alloy composition of the fusible alloy is: a composition consisting of 50 to 58 wt.% Bi, 4 to 7 wt.% Sb and the balance Sn; and a composition in which 0.1 to 1.1 pts.wt. of Cu is added to 100 pts.wt. of the above alloy or 0.1 to 2.6 pts.wt. of Ag is added.
Inventors:
Terasawa, Kiyotomo
Application Number:
JP2001000348369
Publication Date:
December 01, 2006
Filing Date:
November 14, 2001
Export Citation:
Assignee:
NEC SCHOTT COMPONENTS CORP
International Classes:
C22C12/00; H01H37/76; (IPC1-7): C22C12/00; H01H37/76
Previous Patent: DISPLAY ENLARGING DEVICE
Next Patent: METHOD AND APPARATUS FOR MEASURING REFRACTIVE INDEX OF LIGHT SCATTERING BODY
Next Patent: METHOD AND APPARATUS FOR MEASURING REFRACTIVE INDEX OF LIGHT SCATTERING BODY