Title:
高い横方向熱伝導率を有する熱ガスケット
Document Type and Number:
Japanese Patent JP7440004
Kind Code:
B2
Abstract:
An exemplary passive heat transfer apparatus is suited for transferring heat away from an electronic heat generating device to another environment. A gasket has many spaced-apart holes that are transverse to two major opposing surfaces of the gasket. A thermally conductive material is disposed within and fills the holes for conducting heat from one of the two major surfaces to the other major surface. The thermally conductive material is a nanocomposite material having nano-particles aligned substantially perpendicular to the two major opposing surfaces. The thermally conductive material as disposed in the holes has no interfacial boundaries that could adversely affect the transfer of heat.
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Inventors:
Starkovich, John, A.
Silberman, Edward, M.
Kostelec, Andrew, Dee.
Silberman, Edward, M.
Kostelec, Andrew, Dee.
Application Number:
JP2020540310A
Publication Date:
February 28, 2024
Filing Date:
February 26, 2019
Export Citation:
Assignee:
Northrop Grumman Systems Corporation
International Classes:
H01L23/36; F16J15/10; H05K7/20
Domestic Patent References:
| JP6299129A | ||||
| JP2002093969A | ||||
| JP10513611A | ||||
| JP2016062989A |
Foreign References:
| US20030060108 |
Attorney, Agent or Firm:
Kazunobu Kato
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