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Patent Searching and Data


Title:
THERMAL HEAD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH0939282
Kind Code:
A
Abstract:

To always perform, satisfactory printing eliminating the recess of the protective layer of the site where a heating resistive element is disposed and raising the heat transmission efficiency.

The thermal head comprises a board 31 made of metal for forming a chamfered surface 32 by chamfering the end corners in a flat surface, an inorganic insulating layer 33 formed by extending the board to the chamfered surface on the flat surface, a heating resistor layer 34 extended from the chamfered surface of the board to the flat surface of the board to form many heating resistive elements formed by extending from the chamfered surface to the lower part of the end face of the board, individual electrode layer 35 for constituting may individual electrodes formed from the resistor layer of the boundary position between the chamfered surface and the flat surface of the board to the position where only an insulating layer is left by eliminating the resistor layer, and a protective film 41 covering the resistor layer and the electrode layers.


Inventors:
ENDO MITSUHARU
Application Number:
JP19324395A
Publication Date:
February 10, 1997
Filing Date:
July 28, 1995
Export Citation:
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Assignee:
TEC CORP
International Classes:
B41J2/335; (IPC1-7): B41J2/335
Attorney, Agent or Firm:
Takehiko Suzue