THERMAL HEAD AND MANUFACTURE THEREOF

Title:

THERMAL HEAD AND MANUFACTURE THEREOF

Document Type and Number:

Japanese Patent JPS6049964

Kind Code:

A

Abstract:

PURPOSE: To obtain a highly reliable thermal head eliminating poor grounding by forming an insulator by sputtering method with a heat generating resistor and/or a conductive metal wire held at an earth potential.

CONSTITUTION: An undercoat film 2 is formed entirely on an alumina substrate 1 as insulating substrate and then, a 0.1μm thick heat generating resistor 3 made of a Cr-Si alloy and a 1.5μm Al conductors 4 and 6 are formed in a specified pattern. Then, an auxiliary electrode terminal 8 is formed in a specified pattern. The substrate 12 thus laminated and patterned is set on a sputtering device 9 and SiO2 as insulator 5 is formed at the thickness of about 3.5μm by sputtering method. In addition, Si3N4 is formed at the thickness of 1.0W2.0μm by plasma CVD method thereon and a contact through hole is formed in the Si3N4/SiO2 double-layer film.

More Like This:

JPH0344007	MANUFACTURE OF THIN FILM RESISTOR
JP2701565	INDUSTRIAL APPLICABILITY The thin film thermistor and its manufacturing method.
JPH10321405	RESISTOR AND MANUFACTURE THEREOF

Inventors:

FUYAMA MORIAKI
TAMURA KATSU
NUNOKAWA ISAO
FUNIYUU MASAO
HANAZONO MASANOBU
MIYAKE HIROSHI
SATOU AKIRA

Application Number:

JP15785683A

Publication Date:

March 19, 1985

Filing Date:

August 31, 1983

Export Citation:

Click for automatic bibliography generation Help

Assignee:

HITACHI LTD

International Classes:

H01C17/12; B41J2/335; H01L49/00; (IPC1-7): B41J3/20; H01C17/12; H01L49/00

Attorney, Agent or Firm:

Akio Takahashi

Previous Patent: Semiconductor device

Next Patent: THERMAL PRINT HEAD