Title:
THERMAL HEAD
Document Type and Number:
Japanese Patent JP3546006
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal head comprising a protection film with little risk of dielectric breakdown even in the case of printing on a recording medium with a low moisture absorption property.
SOLUTION: A thermal head comprising a heat generating resistor 3 on an insulated substrate 1, with the heat generating resistor 3 covered with a protection film 5 containing a carbon and a silicon, wherein the carbon content ratio in the protection film 5 is set to be 65-90 atm %, and 95.0% or more of the bonds between the carbons is a covalent bond of an sp2 hybrid orbit, is provided.
Inventors:
Hiroshi Masutani
Takayuki Yamamoto
Takayuki Yamamoto
Application Number:
JP2000294950A
Publication Date:
July 21, 2004
Filing Date:
September 27, 2000
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
B41J2/335; (IPC1-7): B41J2/335
Domestic Patent References:
| JP1226711A | ||||
| JP1227218A | ||||
| JP2192011A | ||||
| JP6101047A | ||||
| JP10034989A | ||||
| JP10183350A | ||||
| JP11277782A | ||||
| JP58042472A | ||||
| JP61220302A |