PURPOSE: To make a thermal head compact largely by abolishing a semiconductor device heat radiating board and using a heat generating board as a heat radiating means of the semiconductor device.

CONSTITUTION: A semiconductor device heat radiating board is abolished and a heat to be generated at a semiconductor device 1 is radiated to a heat generating board 2 through a resin 6 charged between the device 1 and the heat generating board 2. Accordingly, it will be possible to make a print board 3 approximate the heat generating board 2 and a thermal head can be compact. Here, it is necessary that the resin 6 to be charged is not adhered to the print board 3 and a base 4. Because, since thermal expansion coefficients of the print board 3 and the base 4 differ largely from that of the heat generating substrate 2, when the print board 3 and the base 4 expand largely by heating at recording of the thermal head, the semiconductor device 1 connected to a film carrier 7 is pulled thereby, so that a connecting member connected with the heat generating board 2 will be cut off.