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Title:
THERMAL INSULATION BOARD
Document Type and Number:
Japanese Patent JPH01153896
Kind Code:
A
Abstract:

PURPOSE: To raise thermal insulation and mechanical strength by filling condensation-preventive processed super fine granules in the spaces of a honeycomb structure.

CONSTITUTION: A thermal insulation board is formed by filling super fine granules, or a filling 3 of super fine granules mixed with fine granules of large diameters in the spaces 1a of the honeycomb structure 1, and fixing plates 2 on both sides of the structure by adhesive layers 4. The super fine granules are excellent for obtaining extremely narrow spaces, however as the super fine granules have condensation properties, the surfaces thereof are condensation- preventive processed so as to prevent condensation. Therefore, it is possible to keep the narrow spaces between the super fine granules.


Inventors:
YOKOGAWA HIROSHI
HIRAO SHOZO
YOKOYAMA MASARU
KISHIMOTO TAKASHI
TAKAHAMA KOICHI
Application Number:
JP31262687A
Publication Date:
June 16, 1989
Filing Date:
December 10, 1987
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
F16L59/02; F25D23/06; (IPC1-7): F16L59/02; F25D23/06
Attorney, Agent or Firm:
Takehiko Matsumoto



 
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