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Title:
THERMAL INSULATION PANEL AND BOX FOR CONVEYANCE
Document Type and Number:
Japanese Patent JP2006077393
Kind Code:
A
Abstract:

To solve a problem in a conventional thermal insulation panel wherein, when the whole of vacuum insulation material is formed of a plurality of sealed chambers, the covering rate thereof occupied by a core is lowered and a thermal insulation performance is lowered.

The vacuum insulation material 1 comprises a plurality of core materials 5 and 6 in a laminate film 2, and vacuum-sealed by surface heaters, respectively. The plurality of core materials 5 are disposed at connection parts 7 connected to a dwelling house. Since the thermal insulation panel 6 is joined to the connection parts 7 of the dwelling house with nails, the other vacuums do not leak even if several vacuums return to normal pressures. Accordingly, the thermal insulation performance is not largely affected. Also, since large cores are disposed at the other portions, the deterioration of thermal insulation performance due to the lowering of the covering rate of the core can be suppressed. Also, the vacuum insulation material can be easily applied to wall materials.


Inventors:
SHIBAYAMA TAKAHITO
Application Number:
JP2004259191A
Publication Date:
March 23, 2006
Filing Date:
September 07, 2004
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
E04B1/76; E04B1/80
Domestic Patent References:
JP2000248653A2000-09-12
JP2004204606A2004-07-22
JPS54178911U1979-12-18
JP2003316363A2003-11-07
JP2000326433A2000-11-28
JPH11270778A1999-10-05
Attorney, Agent or Firm:
Fumio Iwahashi
Tomoyasu Sakaguchi
Hiroki Naito