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Title:
THERMAL LOAD PREDICTING DEVICE
Document Type and Number:
Japanese Patent JP2501263
Kind Code:
B2
Abstract:

PURPOSE: To find a thermal load predicted value of a next day with high precision by correcting thermal load prediction based on the thermal load data of the day even when the thermal load prediction of the previous day is not correct.
CONSTITUTION: Thermal load data stored in a thermal load storage part 7 and factor data, such as the highest temperature predicted value and lowest temperature predicted value of the next data, which vary the load capacity are inputted to a thermal load data classification part 10, and the thermal load data are classified according to factor results, such as past thermal load results and meteorological conditions, which become factors of the thermal load. Based on the classified thermal load data, the thermal load of the day is predicted by a primary thermal load prediction part 15 and a mean value arithmetic part 17, and a thermal load which is specific time later is predicted by a secondary thermal load prediction part 16 based on thermal load data of the day up to now. Then a predictive data correction part 18 selects predictive data which minimizes an error based upon the current thermal load detection data among the respective prediction data and a secondary thermal load prediction part 18 corrects the predicted value.


Inventors:
IWASAKI YOSHIHIKO
SHODA YUKIHIRO
OOHAYASHI MASAKI
ISHIDA TETSUO
KOBAYASHI SHUICHIRO
NAGAIWA AKIHIRO
KODAMA SUMYASU
YAMADA YUKIHIRO
IIDA KATSUHIKO
Application Number:
JP24723791A
Publication Date:
May 29, 1996
Filing Date:
September 26, 1991
Export Citation:
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Assignee:
TOKYO DENRYOKU KK
TOSHIBA KK
International Classes:
G05B17/02; F24F11/02; (IPC1-7): F24F11/02
Domestic Patent References:
JP355453A
JP2115646A
JP5133587A
JP61205332U
Attorney, Agent or Firm:
Takehiko Suzue