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Patent Searching and Data


Title:
THERMAL OVERCURRENT RELAY
Document Type and Number:
Japanese Patent JPH07134935
Kind Code:
A
Abstract:

PURPOSE: To prevent position of a bimetal supporting body from shifting and stabilize the operational conditions by fixing each member by an adhesive filled between a case, a fixing metal, and the bimetal supporting body.

CONSTITUTION: A tongue part 6a of a bimetal supporting body 6 is stored and fixed in a heater supporting body 25. The tip of a pin 25a of the supporting body 25 is inserted into a through hole of a case and the lower end 6b of the supporting body 6 is fixed by fastening a fastening screw 28 by the tip of the bimetal 3. After that, an adhesive 26 is filled into an adhesive flow groove 1d of a case 1, the adhesive 26 is led to the groove 1d and the spaces between the through hole 1c of the case 1 and a male screw part 28a of the fastening screw 28 and between the case and the bimetal supporting body 6. By hardening the adhesive 26, those three members; the case 1, the male screw 28a, and the other end 6b of the bimetal supporting body 6 are fixed.


Inventors:
IKEDA KOSAKU
Application Number:
JP27959393A
Publication Date:
May 23, 1995
Filing Date:
November 09, 1993
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01H61/00; H01H61/01; (IPC1-7): H01H61/01; H01H61/00
Attorney, Agent or Firm:
Takada Mamoru