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Patent Searching and Data


Title:
THERMAL OVERLOAD RELAY
Document Type and Number:
Japanese Patent JP2011113902
Kind Code:
A
Abstract:

To improve a material of a connecting wire in order to reduce error operations due to variations in bending amount of a main bimetal which bends by an overload of a thermal overload relay.

The thermal overload relay is provided with a main bimetal 2 which is bent and displaced by conduction of an overcurrent, a shifter 3 which is displaced responding to the bending of the main bimetal 2, a release lever 5 which follows the displacement of the shifter 3, a contact switching mechanism 6 which is driven by the release lever 5, and a connecting wire 15 which is connected to one end of the main bimetal 2 and of which the other end is connected to a terminal on the load side. The connecting wires 15 consist of three connecting wires corresponding to three phases, and the connecting wire 15 located in the center corresponding to one phase is constructed of a material having a larger thermal conductivity than that of a material of the connecting wires 15 located on both sides corresponding to other phases.


Inventors:
KASHIMURA OSAMU
UCHIYAMA TAKU
MORISHITA FUMIHIRO
FURUHATA YUKIO
KAMOSAKI TAKEO
Application Number:
JP2009271096A
Publication Date:
June 09, 2011
Filing Date:
November 30, 2009
Export Citation:
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Assignee:
FUJI ELEC FA COMPONENTS & SYS
International Classes:
H01H61/02; H01H61/00
Attorney, Agent or Firm:
Yoichi Matsumoto