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Patent Searching and Data


Title:
THERMAL OVERLOAD RELAY
Document Type and Number:
Japanese Patent JPH0757604
Kind Code:
A
Abstract:

PURPOSE: To elongate action time of a thermal overload relay.

CONSTITUTION: Plural thin plates 6 of thermal conductor are laminated and held between a bimetal 4 and a heater 5 for composing a heater element of a thermal overload relay. The bimetal 4 is thus heated after the thin plates 6 are heated by the heater 5, so time till the bimetal gets to a specified action temperature delays to elongate action time of the termal relay. This action time can be regulated as desired by changing the number or thickness of the thin plates 6.


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JP2009199807THERMAL TYPE OVERLOAD RELAY
JPH02291631RELAY
Inventors:
FURUHATA YUKIO
Application Number:
JP22282393A
Publication Date:
March 03, 1995
Filing Date:
August 16, 1993
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H01H61/00; H01H61/013; H01H71/16; H01H71/74; (IPC1-7): H01H61/00; H01H61/013
Attorney, Agent or Firm:
Yoshihide Komada