Title:
サーマルプリントヘッド
Document Type and Number:
Japanese Patent JP7022239
Kind Code:
B2
Abstract:
To provide a thermal print head that can perform printing more surely.SOLUTION: The thermal print head is provided, comprising a semiconductor substrate, a resistor layer having a plurality of heat generation portions, a wiring layer and an insulating layer. The semiconductor substrate has a main surface and a rear surface and a projecting portion. The main surface has a first region and a second region, and the projecting portion has a top surface, a first inclined side surface, and a second inclined side surface interposed between the top surface and the second region and inclined with respect to the main surface. The insulating layer includes a first portion and two second portions, a thickness of the first portion is larger than a thickness of the second portion. The plurality of heat generation portions overlap with the first portion, in a view of direction of the thickness.SELECTED DRAWING: Figure 12
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Inventors:
Nishimura Isamu
Fuwa Hobo
Satoshi Kimoto
Fuwa Hobo
Satoshi Kimoto
Application Number:
JP2021089445A
Publication Date:
February 17, 2022
Filing Date:
May 27, 2021
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
B41J2/335
Domestic Patent References:
| JP2005224950A | ||||
| JP2003080754A | ||||
| JP7081112A |
Foreign References:
| US20060268094 |
Attorney, Agent or Firm:
Usui Nao
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