PURPOSE: To reduce the consumption amount of Au, to permit reduction in the manufacturing cost and to facilitate manufacturing by a method wherein only the terminal portion is formed into a thick film with a thick film printing method, the wiring is formed into a thin film using Al, and this thin wiring is coated with a protective film.

CONSTITUTION: An Au paste is printed on the surface of a substrate 11 with a thick film printing method and then is sintered to form a terminal portion 12. Subsequently, a resistance film 13 and an Al film 14 are formed into thin films all over the surface of the substrate 11 in order. Then, a wiring 16 and a heating portion 15 are formed through etching, and a protective film 17 is formed through sputtering all over the surface leaving the region where the terminal portion 12 is formed.