To provide a high-quality and high-durability thermal printing head which can reduce curving of a head substrate even when a hard thermosetting resin is used for a protection coating so as to protect a wire connecting part.

In the thermal printing head, the long head substrate 13 of a ceramic with a plurality of heating resistors 12 arranged on a surface, and a driving circuit substrate 15 of a resin larger in coefficient of expansion than the head substrate with a wiring circuit 30 stationed thereon are arranged in parallel to each other. Moreover, the thermal printing head is equipped with the IC 14 for driving mounted on the head substrate 13 or the driving circuit substrate 15, and the protection coating 18 of a resin which coats the connecting part 17 of a bonding wire of the IC 14. The protection coating 18 is formed of the thermosetting resin. A first expansion control plate 32 and a second expansion control plate 33 smaller in coefficient of thermal expansion than the driving circuit substrate are bonded to both surfaces of the driving circuit substrate 15, thereby forming a compound plate.