Title:
THERMAL VELOCITY/FLOW SENSOR
Document Type and Number:
Japanese Patent JP2023165980
Kind Code:
A
Abstract:
To provide a thermal velocity/flow sensor with a simple configuration that can reduce the effects of directivity characteristics of heat generation and heat dissipation caused by mounted components on the front and back sides of a substrate.SOLUTION: The thermal velocity/flow sensor includes a flow velocity detection unit 2 that has a temperature measuring element for detecting the temperature of heat, an atmospheric temperature measurement unit 3 that measures the atmospheric temperature, a circuit unit 4 that is provided in an external portion of a substrate 1 and calculates the velocity and flow rate of a fluid, and the substrate 1 on which the flow velocity detection unit 2 and the atmospheric temperature measurement unit 3 are mounted. The substrate 1 includes a substrate main part 10, a substrate portion 11 for the flow velocity detection unit, on which the flow velocity detection unit 2 is mounted, and an elongate-shaped supporting part 13 for the flow velocity detection unit that extends integrally from the substrate main part 10 to the substrate portion 11 for a recording detection unit, and supports the flow velocity detection unit 2. A plurality of through-holes 5 is formed in the supporting part 13 for the flow velocity detection unit, penetrating through the substrate 1.SELECTED DRAWING: Figure 1
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Inventors:
HAYASHI YASUMASA
Application Number:
JP2023169538A
Publication Date:
November 17, 2023
Filing Date:
September 29, 2023
Export Citation:
Assignee:
HORT PLAN LLC
International Classes:
G01P5/12
Attorney, Agent or Firm:
Masaki Kobayashi
Hideki Shinohara
Hideki Shinohara