Title:
熱センサ
Document Type and Number:
Japanese Patent JP5440343
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a compact heat sensor that is high in detection sensitivity and responsivity, easy to manufacture, and surface mountable.SOLUTION: A heat sensor 101 comprises a ceramic element assembly 10 composed of negative characteristic (NTC) thermistor ceramics that serves as a heat sensor body, interior electrodes 1 and 2 for heat sensing, a cavity 5, interior electrodes 6 and 7 for temperature compensation, exterior electrodes 3 and 4, and an exterior electrode 8 for temperature compensation. The cavity 5 is formed between a heat sensing portion with the interior electrodes 1 and 2 for heat sensing formed therein and a temperature compensation portion with the interior electrodes 6 and 7 for temperature compensation formed therein, in the ceramic element assembly 10. The cavity 5 is formed in a manner that the distance between the heat sensing portion and the temperature compensation portion is small at the center and large at the periphery of the cavity 5, and its periphery extends in the direction of the temperature compensation portion.
Inventors:
Shinichiro Nakai
Tadashi Miura
Tadashi Miura
Application Number:
JP2010093022A
Publication Date:
March 12, 2014
Filing Date:
April 14, 2010
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
G01J1/02; G01J5/20; H01L35/30; H01L37/00
Domestic Patent References:
| JP2011033444A | ||||
| JP2001210502A | ||||
| JP10090073A | ||||
| JP8292102A | ||||
| JP7280767A | ||||
| JP6317475A |
Foreign References:
| WO2010044438A1 | ||||
| WO2010064650A1 |
Attorney, Agent or Firm:
Kaede International Patent Office