Title:
THERMAL SHOCK APPLICATION AND TEST METHODS FOR ELECTRONIC PARTS AND THERMAL SHOCK APPLICATION DEVICE USED FOR THEM
Document Type and Number:
Japanese Patent JP3084538
Kind Code:
B2
Abstract:
PURPOSE: To apply a thermal shock which simulates an severe thermal shock which is given when a user performs a soldering treatment to electronic parts in an electronic parts manufacturing stage with a simple configuration.
CONSTITUTION: Frames F1 and F2 for manufacture which hold a plurality of electronic parts with a specified spacing are rapidly heated by a heating means 5 using electromagnetic wave and then are retained at a constant temperature for a specified amount of time. The frames F1 and F2 for manufacture are uniformly and rapidly heated by high energy radiation heating with electromagnetic wave and at the same time are retained at the rapidly heated temperature for a certain amount of time, thus properly simulating a thermal shock which occurs on soldering, completely eliminating the need for silicon oil and a washing process using fluorocarbon for washing it, simplifying the device, and at the same time achieving the enforcement at a low cost.
Inventors:
Kentaro Miyazaki
Youichi Kunieda
Youichi Kunieda
Application Number:
JP13384892A
Publication Date:
September 04, 2000
Filing Date:
May 26, 1992
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L21/66; G01R31/26; (IPC1-7): G01R31/26; H01L21/66
Domestic Patent References:
| JP6041239A | ||||
| JP6246275A |
Attorney, Agent or Firm:
Minoru Yoshida (2 outside)