Title:
THERMAL SPRAY MATERIAL
Document Type and Number:
Japanese Patent JP2017061738
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal spray material excellent in a plasma resistant erosion resistance even to a halogen-based plasma to be used in semiconductor device manufacturing.SOLUTION: A thermal spray material is constituted of a powder containing at least one of yttrium fluoride and oxyfluoride (YOF or the like), and said powder is composed of independent particles made of homogeneous matrix. In the thermal spray material, it is preferred that a specific surface area is less than 0.1 m2/g, that a cumulative pore volume of a pore size of 3 μm or less is 0.02 cm3/g or less, and that an average particle diameter is 60 μm or less. It is preferred: that the ratio of the total of the yttrium fluoride and the oxyfluoride to said powder entirety is 77 mass% or more; and that the average particle diameter is at or more than 0.5 and less than 1.SELECTED DRAWING: None
Inventors:
IBE HIROYUKI
TSUZUKI KAZUSHI
TSUZUKI KAZUSHI
Application Number:
JP2015188918A
Publication Date:
March 30, 2017
Filing Date:
September 25, 2015
Export Citation:
Assignee:
FUJIMI INC
International Classes:
C23C4/04; C01F17/00
Domestic Patent References:
| JP2014136835A | 2014-07-28 | |||
| JP2007308794A | 2007-11-29 | |||
| JPH02289422A | 1990-11-29 | |||
| JP2002363724A | 2002-12-18 | |||
| JP2016505486A | 2016-02-25 | |||
| JPS60238470A | 1985-11-27 | |||
| JP2016211070A | 2016-12-15 | |||
| JP2002302754A | 2002-10-18 | |||
| JP2002115040A | 2002-04-19 |
Foreign References:
| US20150096462A1 | 2015-04-09 |
Attorney, Agent or Firm:
Makoto Abe
Michiko Oi
Seiji Tani
Michiko Oi
Seiji Tani
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