Title:
熱処理装置及び熱処理方法
Document Type and Number:
Japanese Patent JP4030858
Kind Code:
B2
Abstract:
A thermal processing unit of the present invention includes: a holder that holds a plurality of substrates; a reaction container into which the holder is conveyed; a process-gas supplying mechanism that supplies a process gas into the reaction container; and a heating mechanism that heats the reaction container to conduct a film-forming process to the substrates when the process gas is supplied. Flow-rate-parameter table-data associating number-data of the substrates to be processed by one batch-process with target-data of flow-rate parameter of the process gas is stored in a flow-rate-parameter table-data storing part. A controlling unit obtains target-data of flow-rate parameter of the process gas, depending on an actual number of the substrates to be processed by one batch-process, based on the flow-rate-parameter table-data stored in the flow-rate-parameter table-data storing part, and controls the process-gas supplying mechanism according to the obtained target-data. The target-data of flow-rate parameter are determined in such a manner that a speed of the film-forming process is uniform among a plurality of batch-processes in which the numbers of substrates to be processed are different from each other.
Inventors:
Takehiko Fujita
Mitsuhiro Okada
Utazawa Kota
Kazuhide Hasebe
Koichi Sakamoto
Mitsuhiro Okada
Utazawa Kota
Kazuhide Hasebe
Koichi Sakamoto
Application Number:
JP2002316377A
Publication Date:
January 09, 2008
Filing Date:
October 30, 2002
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
C23C16/46; H01L21/205; C23C16/52; F27B17/00; H01L21/00
Domestic Patent References:
| JP10079386A | ||||
| JP2002313728A |
Attorney, Agent or Firm:
Toshio Inoue