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Title:
THERMAL TREATMENT EQUIPMENT AND METHOD THEREFOR
Document Type and Number:
Japanese Patent JP3696505
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide thermal treatment equipment to prevent breakage of a plate-form substance to be treated without incurring of an energy loss when the plate-form substance to be treated is thermally treated at a high temperature, shortens a treatment time, excellently maintain heating chamber temperature distribution characteristics, and be compactly and simply constituted.
SOLUTION: A moving mechanism 18 is provided to reciprocate a placing body 15, on which a plurality of the plate-form substances 3 to be treated can be placed between the internal part of a first heating chamber 13 and the internal part of a second heating chamber 14. An entrance 12b for the substance 3 to be treated communicating with the first heating chamber 13 is provided. The plate-form substances 3 to be treated are placed one by one on the placing body 15 in the first heating chamber 13, and a conveying mechanism 5 to take out the plate-form substances 3 to be treated one by one from the placing body 15 is provided. The heating temperature of the first heating chamber 13 is held at temperature lower than a heating temperature in the second heating chamber 14.


Inventors:
Hiroshi Kawamoto
Application Number:
JP2000382499A
Publication Date:
September 21, 2005
Filing Date:
December 15, 2000
Export Citation:
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Assignee:
Koyo Thermo System Co., Ltd.
International Classes:
F27D3/06; C21D1/00; F27B17/00; F27D19/00; (IPC1-7): F27D3/06; F27D19/00
Domestic Patent References:
JP2000274955A
Attorney, Agent or Firm:
Susumu Nemoto