Title:
THERMAL TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2020118446
Kind Code:
A
Abstract:
To provide a thermal treatment device which can perform thermal treatment to a processed object at a higher temperature and more securely maintain components of a gas in a space, in which the processed object is disposed, to desired values.SOLUTION: A thermal treatment device 1 has a heat insulation body 9 and a seal body 13. The heat insulation body 9 encloses a thermal process space 10 for performing thermal treatment to a processed object 100. The seal body 13 covers a periphery of the heat insulation body 9 in an airtight manner to restrict gas passage.SELECTED DRAWING: Figure 2
Inventors:
AOMI HAJIME
Application Number:
JP2020085598A
Publication Date:
August 06, 2020
Filing Date:
May 15, 2020
Export Citation:
Assignee:
KOYO THERMO SYS KK
International Classes:
F27B9/32; F27B9/04; F27D1/00; F27D7/06
Domestic Patent References:
| JP2005214453A | 2005-08-11 | |||
| JPH06159952A | 1994-06-07 | |||
| JP2001012861A | 2001-01-19 | |||
| JP2003014376A | 2003-01-15 | |||
| JPH06185868A | 1994-07-08 |
Foreign References:
| WO2006013652A1 | 2006-02-09 |
Attorney, Agent or Firm:
Patents corporation Blitas