Title:
熱処理装置
Document Type and Number:
Japanese Patent JP6668708
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To downsize the whole device, and reduce power consumption.SOLUTION: A heat treatment device for performing heat treatment to an object installed inside a device body 10, includes: a coil 40 that heats a heating element 20, mounted with the object in such a manner that the heat element is disposed so as to cover the periphery of the object, with induction heating thereby to indirectly heat the object; cooling means of supplying inactive gas to a space to cool the object; and a reflection member that is disposed over the object in the space, and in which at least one slit 71 extending from a central part 70a toward a peripheral edge part 70b is formed.SELECTED DRAWING: Figure 1
Inventors:
Masaki Takeuchi
Takashi Yoshida
Takashi Yoshida
Application Number:
JP2015233051A
Publication Date:
March 18, 2020
Filing Date:
November 30, 2015
Export Citation:
Assignee:
Fuji Electric Equipment Control Co., Ltd.
International Classes:
F27B5/04; B23K1/002; B23K1/008; B23K31/02; F27B5/14; F27D11/06
Domestic Patent References:
| JP2007158123A | ||||
| JP2013201292A | ||||
| JP2003142241A | ||||
| JP2007262434A | ||||
| JP2003234169A | ||||
| JP2000012548A | ||||
| JP2001308084A | ||||
| JP10206035A | ||||
| JP2012521531A |
Foreign References:
| US20070125770 |
Attorney, Agent or Firm:
Sakai International Patent Office