熱処理装置 - Ihi Co., Ltd.

Title:

熱処理装置

Document Type and Number:

Japanese Patent JP6721466

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To evenly treat a treated object with heat.SOLUTION: A heat treatment device includes: a plurality of heating chambers provided adjacent to an intermediate transportation chamber; and a cooling chamber provided adjacent to the intermediate transportation chamber. The heat treatment device applies prescribed heat treatment to a treated object by moving the treated object between the heating chambers and the cooling chamber via the intermediate transportation chamber. All the heating chambers are arranged so that the treated object has equalized movement distances to the cooling chamber.SELECTED DRAWING: Figure 1

Inventors:

Takuma Yoshida
Ichiro Nakamoto

Application Number:

JP2016177580A

Publication Date:

July 15, 2020

Filing Date:

September 12, 2016

Export Citation:

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