Title:
Thermal type flowmeter
Document Type and Number:
Japanese Patent JP5973371
Kind Code:
B2
Abstract:
In order to provide a method of manufacturing a thermal type flowmeter that is capable of reducing deformation of a semiconductor chip, which is caused by molding, the present invention provides a method of manufacturing a thermal type flowmeter 300 that includes a circuit package 400 of a resin-molded semiconductor chip 602, the method including: resin-molding the semiconductor chip 602 in a state in which a mold 703 is pressed against a heat transfer surface 437 that is provided on a surface of the semiconductor chip 602 and a pressed surface 602a that is set on the surface of the semiconductor chip 602 at a position separate from the heat transfer surface 437.
Inventors:
Shinobu Tashiro
Noboru Tokuyasu
Tsutomu Kono
Morino Takeshi
Watanabe Tsubasa
Noboru Tokuyasu
Tsutomu Kono
Morino Takeshi
Watanabe Tsubasa
Application Number:
JP2013059187A
Publication Date:
August 23, 2016
Filing Date:
March 21, 2013
Export Citation:
Assignee:
Hitachi Automotive Systems, Ltd.
International Classes:
G01F1/692; G01P5/12
Domestic Patent References:
| JP5195819B2 | ||||
| JP5208099B2 | ||||
| JP5318737B2 | ||||
| JP2784286B2 | ||||
| JP5220955B2 | ||||
| JP5456815B2 | ||||
| JP5456816B2 | ||||
| JP4882732B2 | ||||
| JP4577370B2 | ||||
| JP3328547B2 |
Foreign References:
| EP2096423A2 |
Attorney, Agent or Firm:
Yusuke Hiraki
Sekiya Mitsuo
Toshiaki Watanabe
Sekiya Mitsuo
Toshiaki Watanabe