PURPOSE: To reduce space for setting up a thermal type overload relay by forming input/output terminals of a heat element, stored with a contact mechanism in a case, with a plate material at a right angle arranged and mounted on a wall surface of the case.

CONSTITUTION: In a squared case 1, a heat element provided with a bimetal 18 and a thermal conductor 10 and a contact mechanism comprising fixed contacts 5, 6 and a movable contact 7c of a movable contactor 7 are stored. Deformation of the bimetal 18 due to an overload current is transmitted by a lever 6 and a reversing lever 17, to perform opening/closing the contact. In this thermal type overload relay, a plate material is bent or cut raised to form a flat part 11b and connection parts 11a, 12a, having solder connection parts 11a1, 12a1 in the point end at a right angle to this flat part 11b, in input/ output terminals 11, 12 of the thermal conductor 10. These terminals 11, 12 are inserted to a groove 1c and a cut-in 1b, to parallelly arrange the connection parts 11a, 12a vertical to a case wall surface further with the surface opposed.