Title:
THERMALLY ACTIVATABLE ADHESIVE TAPE FOR BONDING ELECTRONIC PART AND CONDUCTOR TRACK
Document Type and Number:
Japanese Patent JP2006009015
Kind Code:
A
Abstract:
To provide a thermally activatable adhesive for bonding an electronic part and a flexible printed circuit board which is lowly flowable at high temperatures.
The thermally activatable adhesive tape for bonding the electronic part and a conductor track comprises the adhesive comprising at least (a) an acid-modified or acid anhydride-modified vinyl aromatic block copolymer and (b) an epoxide compound.
Inventors:
KRAWINKEL THORSTEN DR
RING CHRISTIAN
RING CHRISTIAN
Application Number:
JP2005181016A
Publication Date:
January 12, 2006
Filing Date:
June 21, 2005
Export Citation:
Assignee:
TESA AG
International Classes:
B32B7/12; B32B15/04; C08F8/00; C08L83/00; C09J7/10; C09J153/00; C09J153/02; C09J163/00; H05K3/32
Domestic Patent References:
| JPH1088099A | 1998-04-07 | |||
| JPH01309206A | 1989-12-13 | |||
| JP2004075853A | 2004-03-11 | |||
| JP2002088332A | 2002-03-27 | |||
| JP2002235061A | 2002-08-23 | |||
| JPH0528828A | 1993-02-05 | |||
| JPH01261478A | 1989-10-18 |
Attorney, Agent or Firm:
Heikichi Odashima
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